BT Resin - Features Advantages:
 
BT resin consists mainly of two components, i.e., component B (Bismaleimide) and component T (Triazine) with the advantages of providing high glass transition temperatures Tg (255~330℃), outstanding heat resistance (160~230℃) and moisture resistance, low dielectric constant and dissipation factor…etc. It is a major raw material in the production of IC substrates. 
 
Please see the recent PCB manufacturing information as follows:
 
Finish Size 0.2mm- surface finish- electroless NiPdAu plating (Please find below picture of the actual product)