News Release

Headline Microvia Filling Vias - Dimple Surface Studies

1. If there is a depression in the center of the filling vias, which is a normal phenomenon.
In general, rough 0.2mil to 0.3 mil depth would be accepted at the finished PCB. 

2. If the depression in the center of the filling via during the manufacturing, the factory could use a ceramic brushing or other grinding process, the copper surface would be flat, and then achieved acceptable quality level.