News Release

Headline Board Testing Series— BIB Manufacturing Example (1)

BIB (Burn-in Board) testing is the last board test during the IC manufacturing process. Such test is to ensure that boards with the certain given duration of use are able to perform under high temperature, hot pressure, and hot electricity conditions. Upon completion, we will deliver the good quality IC to the downstream.
 
Please find below some examples to the successful PCB prototypes that we have done:

Actual Product Photo 

Specification

Stack-Up 

Layers: 16L
Thickness: 3.0mm
Finished Copper: 1.0 oz
Board Size: 571.5mm * 609.5mm
Surface Finish: Immersion Gold 3u"
Min. Trace/Space: 5mil/ 5mil
Smallest Hole: 0.28mm
Special Specification:
High Tg180 Material
Controlled Impedance:
Differential impedance 100ohm
 
 
 
Layers: 6L
Thickness: 2.36mm
Finished Copper: 1.0 oz
Board Size: 450mm * 576mm
Surface Finish: Immersion Gold 3u"
Min. Trace/Space: 10mil/ 8.5mil
Smallest Hole: 0.25mm
Special Specification:
High Tg180 Material
Gold Fingers
 
Layers: 12L
Thickness: 1.6mm
Finished Copper: 2.0 oz
Board Size: 313mm * 605mm
Surface Finish: Immersion Gold 3u"
Min.Trace / Space: 5mil/ 5.7mil
Smallest Hole: 0.25mm
Special Specification:
High Tg180 Material
Gold Fingers/ Resin Plugged
 
 
Layers: 10L
Thickness: 1.6mm
Finished Copper: 1.0oz
Board Size: 222mm * 467mm
Surface Finish: Immersion Gold 4u"
Min. Trace / Space: 4mil/ 4mil
Smallest Hole: 0.25mm
Special Specification:   
High Tg180 Material
Gold Fingers
  
 
Layers: 8L
Thickness: 1.6mm
Finished Copper: 2.0oz
Board Size: 222mm * 467mm
Surface Finish: Immersion Gold 3u"
Min. Trace / Space: 4mil/ 4.8mil
Smallest Hole: 0.25mm
Special Specification:
High Tg180 Material
Gold Fingers

Layers: 8L
Thickness: 1.6mm
Finished Copper: 1.0oz
Board Size: 315mm * 616mm 
Surface Finish: Immersion Gold 3u"
Min. Trace / Space: 8mil/ 6mil
Smallest Hole: 0.25mm
Special Specification:
High TGg180 Material
Gold Fingers   
Controlled Impedance:
Differential impedance is 100 ohm with a total of 2 batches; single-ended impedance is 50ohm with a total of 5 batches
 
  
 
Layers: 8L
Thickness: 1.6mm
Finished Copper: 1.0oz
Board Size: 315mm * 616mm
Surface Finish: Immersion Gold 3u"
Min. Trace / Space : 6mil/ 7mil
Smallest Hole: 0.127mm
Special Specification:
High Tg180 Material
Gold Fingers/ Resin Plugged
  
 

Layers: 12L
Thickness: 2.85mm
Finished Copper: 1.0oz
Board Size: 356mm * 432mm
Surface Finish: Immersion Gold 3u"
Min. Trace/Space : 5mil/ 5mil
Smallest Hole: 0.7mm
Special Specification:
High Tg180 Material
Resin Plugged