Probe card testing is mainly applied to check the functions and signals of the un-packed IC. Such test is given during the early manufacturing process to prevent the poor performance of the IC being made. It also reduces the chances of production costs spent on correction in the later process.
Please find below some examples to the successful PCB prototypes that we have done:
|
Actual Product Photo
|
Specification
|
Stack Up
|
|
|
Layers: 4L
Thickness: 3.0mm
BoardSize: 114*170mm
Surface Finish:Immersion Gold 3u"
Min. Trace / Space: 5mil/ 5mil
Smallest Hole: 0.45mm
|
|
|
|
Layers: 6L
Thickness: 4.8mm
Board Size: 214*214mm
Surface Finish: Immersion Gold 3u"
Min. Trace / Space : 5mil/5mil
Smallest Hole: 0.25mm
Special Specification: Countersinks
High Tg180 Material
|
|
|
|
Layers: 8L
Thickness: 3.2mm
Board Size: 356*356mm
Surface Finish: Immersion Gold 3u"
Min. Trace/Space: 8mil/9mil
Smallest Hole: 0.8mm
Special Specification:
Countersinks
|
|