Load board testing is mainly applied to check the functions and signals of the packed IC. Such test is given during the early manufacturing process to prevent the poor performance of the IC being made. It also reduces the chances of production costs spent on correction in the later process. Considering all of the above, such test is important for maintaining a company’s positive reputation.

Please find below some examples to the successful PCB prototypes that we have done:

Actual Product Photo	Specification	Stack-Up
	Layers: 8L Thickness: 3.0mm Board Size: 325*395mm Surface Finish: Immersion Gold 3u" Min. Trace/Space : 4mil/ 5mil Smallest Hole:0.2mm Special Specification: Countersink High Tg180 Material Differential impedance 100ohm
	Layers: 6L Thickness: 5.0mm Board Size: 280*347.5mm Surface Finish: Immersion Gold 3u" Min. Trace/Space: 5mil/5mil Smallest Hole: 0.3mm Special Specification: High Tg180 Material Differential impedance is 100ohm with a total of 2 batches
	Layers: 6L (Actual manufacturing layers: 10L) Thickness: 5.1mm Board Size: 336*336mm Surface Finish: Immersion Gold 3u" Min. Trace/Space: 4mil/2.2mil Smallest Hole: 0.25mm Special Specification: High Tg180 Material