How are the rising popularity of ultrabooks and replacements of WIN 8 do in the new trend of the IC industry?
Multi-function hardware/software integration is the future development of the IC industry
IC components consume little power due to their small size; their performances are in good standing with high bandwidth requirements. However, with all that to be mentioned, do they work best on the overall semiconductor manufacturing industry? How to determine if your hardware or software is compatible with each other? All of these should be taken into serious consideration when creating our layout and designs.
Multi-core application processor, high performance Graphics Processing Units (GPUs), wireless communications technologies, high performance graphics processing chip (GPU), mobile low power SDR SDRAM, electronic system level (ESL) IC design…etc. play a tremendous role in the IC industry. The advanced process of high-speed computing or multimedia application processor and memory system performance, together with the growth of InTouch technologies (i.e. computer accessories, touch mouse, keyboard, touch sensor…etc.) make PC devices gain great influence all over the world.
Changes in the IC industry have also led to another wave of demand in the PCB industry. Literally, people start developing and creating new ways in PCB production in order to meet the standard requirements of the continuous demands in the IC industry. For example, the world’s biggest PCB factory Unimicron has already planned to start up Flip Chip Ball Grid Array new factory for gaining more future business opportunities.
JetPCB has become well-known for our reliance on "proven" techniques with regards to IC testing boards. Following links may guide you through some of the actual productions we have made in the past:
Board Testing Series— BIB Manufacturing Example (1)
Load Board Testing Series—Load Board Manufacturing Example (1)
Board Testing Series— Probe Card Manufacturing Example (1)
For high efficiency boards, please refer to the following:
3 mm and Above High Temperature Board Manufacturing Example (1)
3 mm and Above High Temperature Board Manufacturing Example (2)
*Sources may refer to: CDNews.com.tw