Electronic product devices have become more exquisite in which the requirement to be as small and light as possible is a must within the acceptable range. The R & D and manufacturing technology try their best to achieve this requirement and in the meantime, they obtain the improvement for wire bonding.

However, because Electroless Nickel Immersion Gold (ENIG) cannot create a solderable surface on substrate materials and also, the sales price is almost the same compared to Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), people tend to choose ENEPIG over ENIG.

The advantages of ENEPIG:
·      More-than-a-year shelf life.
·      Solder joint reliability for ENEPIG after multiple reflow.
·      Good performance of finishes for gold wirebonding applications.
·      No corrosion risk after assembly.
·      Solve solder joint embrittlement problems.
·      Solve tin whiskers and other types of problems appeared in pure tin or tin in the compound
       (conductive crystalline wire).
·      Because of the advantage for “one-time surface treatment”, we may use it for the replacement of high
       density boards for ENIG. By doing so, we can decrease the OSP production for board-drying.