Microvia Filling’s advantages:
-
Blind vias to be filled with copper - increasing reliability and credibility
-
Optimizing electrical performance in high frequency design
-
Increasing copper area to improve heat dissipation efficiency
Here are the typical problems engineers might have encountered:
a) Having trouble in layout design because of the restriction on number of layers
b) Special HIGHVOLT request for the application that require heavy current carrying capacity of a through-hole vias.
c) Normal stacked mocrovias connection - so that the layout design is limited.
d) There is a concern that moisture may result in the swelling effect during non-conductive epoxy manufacturing process.
Microvia filling can solve all the above problems at once. Asking RFQ and Experiencing a new process with decent offer!