News Release

Headline Microvia Filling Plating - Any-layer necessay process

Microvia Filling’s advantages:
 

  1. Blind vias to be filled with copper - increasing reliability and credibility
  2. Optimizing electrical performance in high frequency design
  3. Increasing copper area to improve heat dissipation efficiency

 
Here are the typical problems engineers might have encountered:

a)  Having trouble in layout design because of the restriction on number of layers
b)  Special HIGHVOLT request for the application that require heavy current carrying capacity of a through-hole vias.
c)  Normal stacked mocrovias connection - so that the layout design is limited.
d)  There is a concern that moisture may result in the swelling effect during non-conductive epoxy manufacturing process.
 
Microvia filling can solve all the above problems at once. Asking RFQ and
Experiencing a new process with decent offer!